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Engineer - Package Design - San Jose

Company: Micron
Location: California Hot Springs
Posted on: May 3, 2021

Job Description:

Micron's vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. Req. ID: [[id]] As a Package Design Engineer within the Package Development and Engineering team for Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a cross-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation. You will be required to complete design activities within the project schedule and ensure that design outputs are within Assembly and vendor capability. Responsibilities include the following, but not limited to:Codesign Coordination and ManagementSupport feasibility studies and risk assessment for various package optionsInteract with and support die design to enable silicon architecture developmentInteract with key Business Unit stakeholders and assembly subcontractor partners to recommend package solutions to meet customer and/or market requirementsSupport package technology development, including material selection, process development, DOEs, and related activitiesSupport packaging IP developmentProvide design support for thermal/mechanical/electrical simulation analysisSupport the design group's continuous improvement effortsSupport global design alignment activitiesContribute to package design rules and system developmentContribute to package roadmapsContribute to the Competitive Analysis review processCreate Package DesignsSupport die padslog layout/optimizationDesign highly integrated packages using advanced BEOL and RDL flows with an emphasis on optimal electrical performance, manufacturability, and reliability. Work with customers requiring Advanced Packaging technology, internal process design teams, OSATs, and other ecosystem partnersLead set up of designs, rules, and routing methodologies for advanced processes developed by the Advanced Packaging Development CenterLead package and DFMEA (Design for Manufacturing) reviews. Guide design reviews with assembly engineering and subcon teamsGenerate documentation. Ensure timely updates of all assembly documents in database. Provide accurate drafting and drawing support for package drawings, interposer drawings, and manufacturing drawingsWork alongside assembly engineering to work with PCB suppliers, SMT service companies, OSATs, EMS companies, and other ecosystem partners. Translate their requirements into advanced packaging solutions Contribute to a Safety Compliant Work EnvironmentIdentify and promptly report hazardsFollow safety procedures and area work ruleOperate and maintain equipment and tools within manufacturer and company guidelinesUse proper lifting techniques and work in an ergonomically correct mannerQualificationsPhDEE (preferred) or MSEE with a minimum of 3 years of industry or curriculum-based semiconductor packaging experience within the following areas:Controller and/or Advanced Memory Substrate Design (flip chip / wire bond)PCB DesignSignal/Power Integrity Analysis/OptimizationCadence and AutoCAD toolsAssembly Process/MaterialsAssembly DOE definition/managementProduct EngineeringQuality and ReliabilityGood computer skills and proficient in MS OfficeCAD experience (Cadence and AutoCAD preferred)Detail orientatedStrong oral and written communication skillsAbility to interact and work in a team environmentAdvanced electrical circuit knowledgeAbility to read and interpret drawings and schematicsAbility to prioritize and manage multiple projectsTravel as requiredAbout Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions. Through our global brands - Micron and Crucial - our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit /careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact FormKeywords: [[city]] || [[stateProvince]] || [[country]] || [[filter3]] || [[filter1]] || [[customJobType]] || [[filter2]] || [[mfield1]] || [[customEMPTier]] ||

Keywords: Micron, Bakersfield , Engineer - Package Design - San Jose, Other , California Hot Springs, California

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